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Home»Markets»Market expected to reach $983.9 million by 2030 due to increasing opportunities in consumer electronics
Markets

Market expected to reach $983.9 million by 2030 due to increasing opportunities in consumer electronics

prosperplanetpulse.comBy prosperplanetpulse.comApril 19, 2024No Comments4 Mins Read0 Views
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Die attach material market

Die attach material marketDie attach material market

Die attach material market

DUBLIN, April 19, 2024 (Globe Newswire) — The “Die Attach Materials – Global Strategic Business Report” report has been added. ResearchAndMarkets.com Recruitment.

Global die attach materials market expected to reach $983.9 million by 2030

The global market for die attach materials, estimated at USD 741.4 million in 2023, is projected to reach a revised size of USD 983.9 million by 2030, for the analysis period 2023-2030. growing at a CAGR of 3.6% over

Die attach paste, one of the segments analyzed in the report, is projected to register a CAGR of 4.5% and reach USD 505.7 million by the end of the analysis period. The growth of the die attach wire segment is estimated at 3.2% CAGR over the next eight years.

The US market is estimated at $54.3 million, while China is projected to grow at a CAGR of 4.3%

The US die attach materials market is estimated to be USD 54.3 million in 2023. China, the world’s second largest economy, is projected to have a market size of USD 374.1 million by 2030, with a CAGR of 4.3%. Other notable geographic markets include Japan and Canada, which are expected to grow by 2% and 2.7%, respectively, between 2023 and 2030. Within Europe, Germany is expected to grow at a CAGR of approximately 2.3%.

Key attributes:

report attributes

detail

number of pages

377

Forecast period

2023-2030

Estimated market value in 2023 (USD)

$741.4 million

Projected market value to 2030 (USD)

$983.9 million

compound annual growth rate

4.1%

Target area

global


Market trends and drivers

  • Increasing opportunities in consumer electronics sector drive growth

  • Multi-billion smartphone global market: 2016-2023

  • Smartphone penetration rate as a percentage of total population: 2016-2023

  • Global tablet PC market: Breakdown of annual unit sales in 2013, 2018, and 2023 (million units)

  • Global Smart Home Market by Category (USD Billion) in 2020 and 2023

  • Telecommunications: a growing end-use sector

  • Rising trends in the medical device field

  • Global medical device industry in 2000, 2023 and 2025 (US$ billion)

  • Expanding role of electronics in cars drives market

  • Automotive electronics share of vehicle production costs in 2010, 2020 and 2030

  • Average price of in-vehicle electronics per vehicle in 2018, 2025 and 2030 (USD)

  • World car production (million units): 2008-2023

  • Global sales of self-driving cars (millions)

  • Expanding electric vehicle market expands growth opportunities

  • LED technology: new avenues of growth

  • Widespread acceptance of smart cards bodes well

  • Expanding market prospects with emphasis on digitalization and computerization

  • Global digital transformation spending from 2017 to 2023 (US$ billion)

  • Quantum computing trends expand business case

  • Global market for quantum computing in 2020, 2024 and 2027 (US$ million)

  • Increased demand for polymer adhesives

  • Continuing opportunities for eutectic die bonding auger wells

  • Die assembly’s critical role in semiconductor packaging supports growth

  • The importance of epoxy die bonding remains

  • New opportunities in photonics manufacturing

  • Market benefits from growing importance of 3D packaging

Market overview

  • Introduction to die attach materials

  • polymer adhesive

  • Eutectic die attach material

  • conductive die attach paste

  • Non-conductive die attach paste

  • conductive die attach film

  • Non-conductive die attach film

  • Semi-sintered paste and sintered paste

  • solder paste

  • Wafer backside coating

  • bonding wire

  • Global market outlook and outlook

  • competitive scenario

  • Recent market activity

  • Die Attach Materials – Global Key Competitors Market Share Percentage in 2023 (E)

  • Competitive Market Presence – Strong/Active/Niche/Mediocre (E) for Players Worldwide in 2023

Focus on carefully selected players(35 posts in total)

  • Dow Corporation

  • Dupont de Nemours

  • Evonik Industries AG

  • Huntsman International LLC

  • Henkel AG & Co. KGaA

  • HB Fuller Company

  • Heraeus Holding GmbH

  • i Technology Co., Ltd.

  • Bostik, an Arkema company

  • ASM Pacific Technology Co., Ltd.

  • Indium Co., Ltd.

  • Caplink Co., Ltd.

  • Creative Material Co., Ltd.

  • BE Semiconductor Industries NV

  • DIAS Automation (Hong Kong) Ltd.

For more information on this report, please visit https://www.researchandmarkets.com/r/hx52ov.

About ResearchAndMarkets.com
ResearchAndMarkets.com is the world’s leading source of international market research reports and market data. We provide the latest data on international and regional markets, key industries, top companies, new products and latest trends.

attachment

CONTACT: CONTACT: ResearchAndMarkets.com Laura Wood,Senior Press Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./ CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900



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